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Modular Unit for Thermal Conductivity Measurements in Multiple Cryogenic/Magnetic Field Environments
Category(s):
For Information, Contact:
Craig Forney
Commercialization Manager, Chemistry and Materials Sciences
515-294-4740
licensing@iastate.edu
Web Published:
2/16/2017
ISURF #
4582
Summary:
Iowa State University and Ames Laboratory researchers have developed a modular sample stage and thermal conductivity measurement device that is compatible with a variety of cryogenic and magnetic field apparatus.  This modular device allows for easy switching between apparatus to perform a variety of measurements without sample or thermometer remounting.

Development Stage:
Description:
The thermal conductivity of a material is of great importance for determining suitability for a given application.  While many techniques have been developed to measure thermal conductivity at moderate temperatures, measurement at low (sub-kelvin) temperatures are difficult to achieve.  These low temperature measurements are important to characterize novel materials, particularly in determining the superconducting state while isolating electronic degrees of freedom.

As there is no singular cyrogenic solution for measurement of thermal conductivity that can cover broad ranges of temperature, magnetic field strength, and magnetic field direction, thorough characterization requires the sample to be tested in multiple apparatus.  A modular and portable sample stage and conductivity measurement device that can be readily moved between apparatus, and is compatible with broad temperature and magnetic field ranges, is desirable to reduce the error introduced by multiple setups as well as different thermometers and calibrations.

Advantage:
• Modular sample stage and measurement device compatible with a variety of cryogenic and magnetic field devices.
• Minimizes sample handling and mounting and eliminates experimental error from different thermometers and calibration.

Application:
Low temperature (< 1K) thermal conductivity characterization of novel materials.
Patent Information:
*To see the full version of the patent(s), follow the link below, then click on "Images" button.


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