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ISU researchers have developed a method to produce ultra-flat metal surfaces without the compromises inherent to chemical-mechanical polishing (CMP).

Ultra-flat surfaces are important commercially for the semiconductor fabrication industry, and also are of interest for scientific studies of self-assembled monolayers, bilayers, electrodes and single-molecules. There are several methods to create ultra-flat surfaces including CMP which is the most common method currently used but is often a method of compromises, attempting to balance material removal rate against the susceptibility to produce scratches and other faults into the material. ISU researchers have developed new method of creating ultra-flat surfaces through a “mechanical annealing” process. The technique involves the bombardment of a surface with atoms (principally from transition metals) that fill in surface faults and results in an atomically flat surface.

• Significant cost reduction compared to CMP

• Consistent, reproducible flat surface

• Very large semiconductor market

• Minimal cleanup after surface fabrication

Semiconductor fabrication and scientific research