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Improved Eddy Current Coil Design for Nondestructive Evaluation
Category(s):
For Information, Contact:
Jay Bjerke
Commercialization Manager, Engineering
515-294-4740
licensing@iastate.edu
Web Published:
5/5/2015
ISURF #
3062
Summary:
Researchers have developed an improved design and method for making eddy current coils that are used in eddy current sensing probes for nondestructive testing.

Development Stage:
ISU is seeking partners interested in commercializing this technology

Description:
Eddy current sensing has been a staple in techniques used for nondestructive evaluation of critical components such as air frames or engine parts. Coils used for eddy current sensing probes have traditionally been formed by hand by winding a wire a number of times around a core.  However, this approach to forming coils leads to variations in number of turns in a coil, spacing between the turns, and alignment of turns on the core, resulting in high variability in the coils and the eddy current sensing probes.  The significant variability of eddy current probe sensitivity has been recognized as an important issue for decades, and yet no satisfactory resolution has been found to date.  To address this issue, Iowa State University researchers have developed an improved eddy current coil design and fabrication procedure in which the coil is formed through depositing film traces. This process is amenable to machine manufacturing and provides more precision and uniformity in the coils, thus reducing their performance variability.  In addition, this method may enable the manufacture of probes that are smaller and more sensitive, and may be used for probes that have a single coil or a sensor array.

Advantage:
• Consistent (probes fabricated from these coils will give highly reproducible results)
• Simple (fabrication method is amenable to automation and avoids tedious forming by hand)
• Versatile (probe elements of various sizes can be produced)
Application:
Nondestructive evaluation
Patent Information:
*To see the full version of the patent(s), follow the link below, then click on "Images" button.
Country Serial No. Patent No. Issued Date
United States 11/064,325 7,795,863* 9/14/2010


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